The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Jun. 09, 2000
Takashi Miyazaki, Matsumoto, JP;
Hiroki Nakahara, Shiojiri, JP;
Takashi Miyazaki, Matsumoto, JP;
Hiroki Nakahara, Shiojiri, JP;
Seiko Epson Corporation, , JP;
Abstract
The present invention provides a manufacturing method or a structure capable of reducing occurrence of sealing defects and breaking defects by resolving defects in form of a joined area between a sealing material and an anisotropic conductive material. A sealing material () is formed in such a manner as to superimpose ends () on alignment marks () formed on the surface of a first substrate (), an anisotropic conductive material is formed in such a manner as to superimpose endson alignment marks () formed on the surface of a second substrate (), and the sealing materialand the anisotropic conductive material () are joined by bonding the first substrate () and the second substrate () to form one-piece sealing section ().