The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
May. 11, 2000
Tooru Ukita, Tokyo, JP;
Tooru Ukita, Tokyo, JP;
NEC LCD Technologies, Ltd., Kanagawa, JP;
Abstract
To make the test probe not directly in contact with the electrode pads for the semiconductor chip mounting, without using an advanced technology for making the pitch of electrode pads narrower, and remove the chip mounting failures such as scratching of electrode pads caused by testing, adherence of impurity particles, electrical corrosion. The electrode padsformed on the distal ends of the external leadsfor press-connecting the input electrodesof the semiconductor chipare disposed at both sides (shown as L) of the semiconductor chip. The terminal-electrode leadsfrom the electrode padspass under the semiconductor chipwhile keeping a pitch of the electrode pads. The test electrode padsare disposed in alternate arrangement on the distal ends of terminal-electrode leads. The test electrode padsmay be disposed in alternate arrangement in three steps or more of multiple steps.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile