The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
May. 11, 2000
Applicant:
Thomas Zeiler, Regensburg, DE;
Inventor:
Thomas Zeiler, Regensburg, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/44 ; H01L021/48 ; H01L021/50 ; H01L023/48 ; H01L023/52 ;
U.S. Cl.
CPC ...
Abstract
A method for producing a semiconductor component includes coating a substrate with a metalization. The metalization is structured in such a way that interconnects are formed at least in an encapsulation region. An encapsulation is applied in the encapsulation region around a previously applied chip. In order to provide sealing during the application of the encapsulation, either the interconnects are structured in such a way that they are interconnected, or a labyrinth structure is formed between the interconnects.