The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
May. 14, 2002
Vijay Sarihan, Paradise Valley, AZ (US);
Owen Fay, Gilbert, AZ (US);
Lizabeth Ann Keser, Chandler, AZ (US);
Vijay Sarihan, Paradise Valley, AZ (US);
Owen Fay, Gilbert, AZ (US);
Lizabeth Ann Keser, Chandler, AZ (US);
Freescale Semiconductor, Inc., Schaumburg, IL (US);
Abstract
A method for creating an under bump metallization layer () is provided. In accordance with the method, a die () is provided which has a die pad () disposed thereon. A photo-definable polymer (or) is deposited on the die pad, and an aperture () is created in the photo-definable polymer. Finally, an under bump metallization layer () is deposited in the aperture. A die package is also provided comprising a die having a die pad () disposed thereon, and having an under bump metallization layer () disposed on the die pad. The structure has a depression or receptacle () therein and has a thickness of at least about 20 microns.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile