The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Dec. 10, 2001
Helmut Heinz, Ansbach, DE;
Friedrich Nehmeier, Erlangen, DE;
Bernhard Schuch, Neusitz, DE;
Hubert Trageser, Nuremberg, DE;
Helmut Heinz, Ansbach, DE;
Friedrich Nehmeier, Erlangen, DE;
Bernhard Schuch, Neusitz, DE;
Hubert Trageser, Nuremberg, DE;
Conti Temic microelectronic GmbH, Nuremberg, DE;
Abstract
Electronic packages are produced as follows. Vias in a support body are closed with a highly viscous screen printing material following application of a first metallizing layer forming a base metallization on the support body and in the lead-throughs for the vias. A low viscosity passivating layer, which has been applied on the entire surface of the top and bottom sides of the support body, is selectively removed from certain areas of the top side. A second metailizing layer forming the final metallization of a low-melting point material is applied to the first metallization layer in the areas from which the passivating layer was removed. Electronic components of the circuit arrangement are applied on the top side of the support body and contacted by a soldering process.