The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
May. 28, 2002
Hiroshi Sakai, Tokyo, JP;
Motoji Suzuki, Tokyo, JP;
Makoto Igarashi, Niigata, JP;
Akihiro Tanaka, Niigata, JP;
Hiroshi Sakai, Tokyo, JP;
Motoji Suzuki, Tokyo, JP;
Makoto Igarashi, Niigata, JP;
Akihiro Tanaka, Niigata, JP;
NEC Corporation, Tokyo, JP;
Abstract
An electronic component that is provided with leads at a narrow pitch that are plated with solder is packaged by soldering the leads to lands on a printed circuit board on which the lands have been formed in a pattern of arrangement that corresponds to said leads. When packaging, solder paste is printed over areas on the lands that are greater in area than the area of the lands. The leads are then placed on this solder paste, and the solder paste is subjected to reflow to solder the leads onto the lands.