The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2005

Filed:

Aug. 06, 2004
Applicants:

Wen He, Kunsan, CN;

Fujin Peng, Kunsan, CN;

Nick Lin, Tu-Chen, TW;

Inventors:

Wen He, Kunsan, CN;

Fujin Peng, Kunsan, CN;

Nick Lin, Tu-Chen, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K001/00 ;
U.S. Cl.
CPC ...
Abstract

An electrical connector () for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (), and terminals () received in passageways () of the housing. The housing defines a base () and four sidewalls (), the base and the sidewalls cooperatively defining a space therebetween for receiving the LGA chip. The base has a multiplicity of passageways along a length thereof, for receiving the corresponding terminals therein. Two adjacent sidewalls each define a resilient beam () with an incline surface and joining the sidewall at two ends. A space () is defined between the beam and the sidewall. When the LGA chip is placed on the base, the two resilient beams can resiliently act on the chip to ensure reliable engagement between the LGA chip and the connector.


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