The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Oct. 01, 2003
Teruyoshi Kubokawa, Fukushima-ken, JP;
Kunio Kosaka, Fukushima-ken, JP;
Takafumi Nomura, Fukushima-ken, JP;
Teruyoshi Kubokawa, Fukushima-ken, JP;
Kunio Kosaka, Fukushima-ken, JP;
Takafumi Nomura, Fukushima-ken, JP;
Alps Electric Co., Ltd., Tokyo, JP;
Abstract
A method for soldering an electronic component is provided. A first solder land containing copper and a second solder land are formed on a surface of a circuit board. A first solder section composed of a Sn—Ag—Cu solder material is formed on each of the first and the second solder lands, and a terminal of an electronic component chip is mounted on the first solder land. The first solder land and the terminal are fusion-bonded. A second solder section composed of a Sn—Zn solder material is formed on the first solder section disposed on the second solder land. A lead terminal of another electronic component is inserted into a terminal hole formed near the second solder land; and the second solder section and the lead terminal are heated at a temperature lower than the previous temperature to connect the lead terminal to the second solder section by fusion bonding.