The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Dec. 20, 2002
Applicant:
Hiroshi Yagawa, Tokyo, JP;
Inventor:
Hiroshi Yagawa, Tokyo, JP;
Assignee:
Tyco Electronics AMP K.K., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21J015/10 ;
U.S. Cl.
CPC ...
Abstract
A riveting apparatus has a support die with a support surface. The support surface supports a rivet that extends through a circuit board and an electrical connector. The support surface has a first inclined surface, a second inclined surface, and a depression positioned therebetween. The depression receives a head of the rivet and positionally aligns the rivet with an upper tool unit as the rivet is guided across the first inclined surface toward the second inclined surface. The upper tool unit fastens the rivet to the circuit board.