The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2005
Filed:
Jul. 24, 2003
James A. Zollo, Weston, FL (US);
John K. Arledge, Ft. Lauderdale, FL (US);
John C. Barron, Davie, FL (US);
Gary R. Burhance, Boynton Beach, FL (US);
John Holley, Dacula, GA (US);
Henry F. Liebman, Tamarac, FL (US);
James A. Zollo, Weston, FL (US);
John K. Arledge, Ft. Lauderdale, FL (US);
John C. Barron, Davie, FL (US);
Gary R. Burhance, Boynton Beach, FL (US);
John Holley, Dacula, GA (US);
Henry F. Liebman, Tamarac, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A substrate assembly () and method of making same has at least one embedded component () in a via () of a substrate core () and includes a first adhesive layer () coupled to the substrate core, and a second adhesive layer () on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer () adhered to the bottom surface of the substrate core and a second conductive layer () on the second adhesive layer. The substrate assembly can further include an interconnection () between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening () that at least temporarily exposes at least a conductive surface () of the embedded component.