The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Oct. 03, 2003
Christo P. Bojkov, Plano, TX (US);
Michael L. Krumnow, Plano, TX (US);
Christo P. Bojkov, Plano, TX (US);
Michael L. Krumnow, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A metal structure () for a bonding pad on integrated circuit wafers, which have interconnecting metallization () protected by an insulating layer () and selectively exposed by windows in the insulating layer. The structure comprises a patterned seed metal layer () positioned on the interconnecting metallization exposed by the window so that the seed metal establishes ohmic contact to the metallization as well as a practically impenetrable seal of the interface between the seed metal and the insulating layer. Further, a metal stud () is formed on the seed metal and aligned with the window. The metal stud is conformally covered by a barrier metal layer () and an outermost bondable metal layer ().