The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Oct. 01, 2003
Woojin Kim, Pleasanton, CA (US);
John Dancaster, San Ramon, CA (US);
John Logan, Danville, CA (US);
Aniela Bryzek, Hayward, CA (US);
Woojin Kim, Pleasanton, CA (US);
John Dancaster, San Ramon, CA (US);
John Logan, Danville, CA (US);
Aniela Bryzek, Hayward, CA (US);
General Electric Company, Plainville, CT (US);
Abstract
A surface mount package for a multi-chip device has a leadframe formed with first and second die pads and leadouts from the respective die pads. An environmentally responsive sensor chip is secured to the first die pad and an environmentally isolated chip is secured to the second die pad. The chips are electrically coupled through the lead frame. A body formed with an over molded portion encases the isolated chip and an open molded portion formed with a recess receives the environmentally sensitive chip. An apertured cover is secured in the recess to form a protective covering over the sensor chip and for allowing communication of the sensor chip externally of the package.