The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
May. 14, 2003
Applicants:
Yuji Ozaka, Okazaki, JP;
Mitsumasa Seko, Kariya, JP;
Tsutomu Onoue, Kariya, JP;
Manabu Ishiguro, Kariya, JP;
Inventors:
Yuji Ozaka, Okazaki, JP;
Mitsumasa Seko, Kariya, JP;
Tsutomu Onoue, Kariya, JP;
Manabu Ishiguro, Kariya, JP;
Assignee:
Denso Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B27M003/00 ; B27W005/02 ;
U.S. Cl.
CPC ...
Abstract
In a method of manufacturing a resin molded article, resin including a foaming agent is injected into a cavity defined in a mold assembly. Then, a movable mold of the mold assembly is moved to partly expand the cavity so that the foaming is promoted at the part where the cavity is expanded. Therefore, a high foamed portion having voids therein and a low foamed portion having an expansion ratio less than that of the high foamed portion are integrally formed in the resin molded article.