The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Mar. 14, 2003
Akihiro Sano, Hitachi, JP;
Kinya Kobayashi, Hitachi, JP;
Akihiro Sano, Hitachi, JP;
Kinya Kobayashi, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The object of the present invention is to provide a film thickness distribution analysis method that ensures quick and effective prediction of film thickness distribution by computer simulation in the pattern plating process. On the circuit pattern of a printed circuit board, in the method for analyzing the thickness distribution of metal film plated selectively, hypothetically dividing the printed circuit board into one or more regions, introducing pattern density θj=Aj/Sj (Sj: the area Sj of a desired region j, and Aj: the area of the plated surface inside the area j), and calculating the approximate average current density or film thickness distribution based on 'approximation averaged by pattern density'.