The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2005
Filed:
Dec. 05, 2002
Seiichiro Ishio, Kariya, JP;
Yasutoshi Suzuki, Okazaki, JP;
Seiichiro Ishio, Kariya, JP;
Yasutoshi Suzuki, Okazaki, JP;
Denso Corporation, Kariya, JP;
Abstract
A pressure sensor includes a sensor element, and a resin package member that holds the sensor element. The sensor element is constructed by a semiconductor, and is capable of externally outputting an electric signal in accordance with strain generated when force is applied thereto. The sensor element is directly adhered to the package member via an adhesive layer that has Young's modulus in a range between 2.45×10Pa and 2.06×10Pa. Further the adhesive layer has a thickness equal to or more than 110 μm. Accordingly, the pressure sensor effectively restricts a variation in a sensor characteristic due to a thermal change.