The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Aug. 13, 2003
Ken Nguyen, San Jose, CA (US);
Wei Huang, Fremont, CA (US);
Ken Nguyen, San Jose, CA (US);
Wei Huang, Fremont, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A method of routing a metal layer trace in an integrated circuit die includes steps of: (a) receiving as input a netlist of an integrated circuit die; (b) selecting a redistribution layer trace from the netlist for routing the redistribution layer trace between an I/O pad of the integrated circuit die and a termination point; (c) comparing a trace width of the redistribution layer trace with a maximum trace width limit; and (d) if the trace width of the redistribution layer trace exceeds the maximum trace width limit, then routing the redistribution layer trace as a plurality of separate parallel traces each having a trace width that is less than the selected maximum trace width limit.