The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2005

Filed:

Mar. 11, 2002
Applicants:

Joseph T. Boyd, Cincinnati, OH (US);

Don C. Abeysinghe, Cincinnati, OH (US);

Samhita Dasgupta, Niskayuna, NY (US);

Howard E. Jackson, Cincinnati, OH (US);

Inventors:

Joseph T. Boyd, Cincinnati, OH (US);

Don C. Abeysinghe, Cincinnati, OH (US);

Samhita Dasgupta, Niskayuna, NY (US);

Howard E. Jackson, Cincinnati, OH (US);

Assignee:

University of Cincinnati, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B006/26 ;
U.S. Cl.
CPC ...
Abstract

A novel fiber optic sensor configuration whose diameter is the same as that of the optical fiber on which it is directly fabricated is introduced. A simple MEMS-compatible fabrication process to accomplish micromachining on the fiber end face has been developed and is detailed. This sensor configuration significantly reduces the size of the sensor and makes the packaging simple and adhesive free. The micromachining process of the present invention also provides for the fabrication of arrays of sensors that would provide two dimensional maps with high spatial resolution of at least one of acoustical vibration, mechanical vibration, pressure, temperature, acceleration, electrostatic fields, magnetic fields or combinations thereof.


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