The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
May. 28, 2003
Yasushi Kinoshita, Tokyo, JP;
Yasushi Kinoshita, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A semiconductor integrated circuit is provided. A semiconductor package having a printed circuit board, a semiconductor chip mounted on a first surface of said printed circuit board, at least one power supply electrode on a second surface of said printed circuit board and connected to at least one power supply terminal of said semiconductor, and at least one ground electrode on a second surface of said printed circuit board and connected to at least one ground terminal of said semiconductor chip; a decoupling capacitor outside said semiconductor package and formed by a power supply plane connected to said power supply electrodes, and a ground plane connected to said ground electrodes; at least one power supply electrode pad connected to said power supply plane; and at least one ground electrode pad connected to said ground plane.