The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Dec. 10, 2001
Hajime Hasebe, Hakodate, JP;
Atsushi Fujisawa, Hakodate, JP;
Makoto Aida, Hitachi, JP;
Motoya Ishida, Hitachi, JP;
Yasuhiro Kashimura, Kitaibaraki, JP;
Yoichi Kinouchi, Hitachi, JP;
Hajime Hasebe, Hakodate, JP;
Atsushi Fujisawa, Hakodate, JP;
Makoto Aida, Hitachi, JP;
Motoya Ishida, Hitachi, JP;
Yasuhiro Kashimura, Kitaibaraki, JP;
Yoichi Kinouchi, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Renesas Northern Japan Semiconductor, Inc., Hokkaido, JP;
Abstract
A semiconductor device having a seal member of insulative resin, tab suspension leads and leads exposed to the mounting surface of the seal member, a semiconductor element located in the seal member and fixed by an adhesive of the tab surface, and conductive wires for electrically connecting electrodes of the semiconductor element to the leads. At least a lead portion of the leads has an inverted trapezoid-like section configured of a upper surface embedded in the seal member, a lower surface exposed from the seal member, and side surfaces connecting the two side edges of the upper and lower surfaces. Two side edges of the upper surface are formed with machined surfaces, respectively, having one end connected to the upper surface and the other end connected to side surfaces. The machined surfaces are formed by the pressing process in different directions of extension with the upper and side surfaces.