The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2005

Filed:

Oct. 29, 2003
Applicants:

Hong-seong Son, Suwon, KR;

Sang-rok Hah, Seoul, KR;

Ja-eung Koo, Goyang, KR;

Inventors:

Hong-Seong Son, Suwon, KR;

Sang-Rok Hah, Seoul, KR;

Ja-Eung Koo, Goyang, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/20 ;
U.S. Cl.
CPC ...
Abstract

A method of fabricating a semiconductor device is provided. The method includes forming an interconnection line over a ssubstrate. The interconnection line functions as a first electrode. A first insulating layer is formed on the substrate including the metal interconnection line. An electrode layer and an oxide layer are formed on the first insulating layer. A photoresist pattern is formed on the oxide layer. The oxide layer and the electrode layer are etched using the photoresist pattern as an etching mask. As a result, a second electrode and an oxide layer pattern, which are stacked, are formed over the interconnection line. At least the electrode layer is etched using a wet etching technique. The photoresist pattern is then removed.


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