The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2005

Filed:

Dec. 28, 2001
Applicants:

Kohshi Yoshimura, Hyogo, JP;

Takeshi Nishiuchi, Osaka, JP;

Fumiaki Kikui, Osaka, JP;

Masahiro Asano, Kyoto, JP;

Takahiro Isozaki, Kyoto, JP;

Inventors:

Kohshi Yoshimura, Hyogo, JP;

Takeshi Nishiuchi, Osaka, JP;

Fumiaki Kikui, Osaka, JP;

Masahiro Asano, Kyoto, JP;

Takahiro Isozaki, Kyoto, JP;

Assignee:

Neomax Co., Ltd., Osaka-fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D005/02 ; C25D005/00 ; H01F007/06 ;
U.S. Cl.
CPC ...
Abstract

An electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis and supplying a plating electric current to the work. Alternatively, a separate member may supply the plating electric current to the work. A plating solution in the hole in the work may be allowed to flow. Thus, a uniform plated film can be formed on both of the outer and inner surfaces of the work having the communicating with the outside such as a ring-shaped work, of which a ring-shaped bonded magnet is representative, by using the electroplating device.


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