The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Jan. 15, 2003
Applicants:
Kazuki Ikeda, Hyogo, JP;
Hiroshi Tanaka, Hyogo, JP;
Hisao Irie, Hyogo, JP;
Keigo Obata, Hyogo, JP;
Takao Takeuchi, Hyogo, JP;
Naoya Inoue, Hyogo, JP;
Inventors:
Kazuki Ikeda, Hyogo, JP;
Hiroshi Tanaka, Hyogo, JP;
Hisao Irie, Hyogo, JP;
Keigo Obata, Hyogo, JP;
Takao Takeuchi, Hyogo, JP;
Naoya Inoue, Hyogo, JP;
Assignee:
Harima Chemicals, Inc., Kakogawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C018/00 ;
U.S. Cl.
CPC ...
Abstract
According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.