The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Aug. 03, 2001
Harjinder Dulai, Unionville, CA;
Yen-ming Chen, Markham, CA;
Colin Szeto, North York, CA;
Edward J. Laurin, Etobicoke, CA;
Steven D. Daniels, Thornhill, CA;
Jean Francois Drolet, Toronto, CA;
Harjinder Dulai, Unionville, CA;
Yen-Ming Chen, Markham, CA;
Colin Szeto, North York, CA;
Edward J. Laurin, Etobicoke, CA;
Steven D. Daniels, Thornhill, CA;
Jean Francois Drolet, Toronto, CA;
ATI Technologies, Inc., Thornhill, CA;
Abstract
A high density interconnection device includes a high density connector block having a plurality of jacks disposed on the outer surface for common interconnected to a high density connector. A recessed portion formed on the first side surface defines a first multi-faceted surface having a plurality of angularly disposed first surface elements. A projecting portion formed on the second side surface defines a second multi-faceted surface having a plurality of angularly disposed second surface elements. In another embodiment, one group of jacks are defined in a first plane, and another group of jacks are defined in a second plane. The first and second planes are substantially parallel such that the first and second groups of jacks are offset.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile