The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2005
Filed:
Jul. 24, 2001
Robert Albert Boie, Bridport, VT (US);
Jungsang Kim, Basking Ridge, NJ (US);
Hyongsok Soh, Basking Ridge, NJ (US);
Robert Albert Boie, Bridport, VT (US);
Jungsang Kim, Basking Ridge, NJ (US);
Hyongsok Soh, Basking Ridge, NJ (US);
Lucent Technologies Inc., Murray Hill, NJ (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
A packaged MEMS device containing the micro mirrors has mounted on it at least two distinct integrated circuit chips, at least one of which contains the low-voltage digital-to-analog converts and at least one of which contains the high-voltage amplifiers. The integrated circuit chips may be mounted directly to the MEMS package, or they may be indirectly mounted thereto, e.g., by being directly mounted to a multi-chip module which is in turn mounted on the package. Thus, the MEMS package is employed in a dual role, 1) that of package for the MEMS device and 2) the role of a backplane in that it contains mounting places and the wires interconnecting the MEMS device and chips or modules containing the low-voltage digital-to-analog converters and the high-voltage amplifiers.