The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2005

Filed:

Sep. 26, 2001
Applicants:

Takayasu Komatsu, Tokyo-to, JP;

Hirofumi Hideshima, Tokyo-to, JP;

Akira Makita, Tokyo-to, JP;

Yutaka Matsumoto, Tokyo-to, JP;

Takuya Ogio, Tokyo-to, JP;

Inventors:

Takayasu Komatsu, Tokyo-to, JP;

Hirofumi Hideshima, Tokyo-to, JP;

Akira Makita, Tokyo-to, JP;

Yutaka Matsumoto, Tokyo-to, JP;

Takuya Ogio, Tokyo-to, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J029/80 ;
U.S. Cl.
CPC ...
Abstract

The present invention provides a shadow mask having an improved resistance to an impact such as vibration or dropping so as to keep a constant quality of a color cathode-ray tube. The object is achieved by a shadow mask in which throughholes are formed, each of the throughholesandhaving a rear side hole portionorthrough which an electron beam enters and a front side hole portionorthrough which the electron beam is emitted so as to form a beam spot having a prescribed shape on a surface to be irradiated; wherein, each of the throughholesandhas a ridge portionorformed by intersection of a taper surfaceorof the rear side hole portionorand a taper surfaceorof the front side hole portionor; the taper size T represented by a value a half the difference between the hole width S at endorof the front side hole portionorand the hole width Q at the ridge portionoris within a range of from 30 to 40% of the thickness t of the shadow mask; and the ridge portion is formed at a sectional height of up to 35 μm from the endof the rear side hole portionor


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