The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2005
Filed:
Feb. 19, 2002
Applicant:
Tomio Yamashita, Ogaki, JP;
Inventor:
Tomio Yamashita, Ogaki, JP;
Assignee:
Sanyo Electric Co., Ltd., Moriguchi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/52 ;
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a semiconductor device having flat pads. An opening and island-like dielectric films are first formed in a dielectric film. The opening is then filled with metal, and a metal layer is formed on the dielectric film. The upper surface of the metal layer is flattened using the CMP technique with the upper surface of the dielectric film functioning as a stopper. The island-like dielectric films prevent the occurrence of dishing in a conductive portion.