The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2005
Filed:
Jan. 15, 2004
Yoshihiro Basho, Kokubu, JP;
Ryuji Mori, Kokubu, JP;
Masahiko Miyauchi, Kokubu, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
A package for accommodating a semiconductor element includes a heat releasing member having a mounting portion for a semiconductor element, a frame having a wiring conductor, and a lid attached so as to cover the mounting portion. In the heat releasing member, a plurality of through-metal members made of a copper are buried in the mounting portion of a substrate made of a matrix of tungsten or molybdenum and copper to another surface. Copper layers are joined at least to upper and lower surfaces of a portion in which the through-metal members are buried, and a cross-section area of each of the through-metal members is gradually increased from the center side of the substrate to a joint portion with the copper layers.