The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2005
Filed:
Nov. 08, 2002
Kazuhiro Shiomi, Ibaraki, JP;
Masaaki Ishio, Osaka, JP;
Kazuhiro Shiomi, Ibaraki, JP;
Masaaki Ishio, Osaka, JP;
Neomax Materials Co., Ltd., Osaka, JP;
Daishinku Corporation, Kakogawa, JP;
Abstract
A lid material () according to the present invention comprises: a base layer () composed of a low thermal expansion metal; an intermediate metal layer () provided on one surface of the base layer () and composed of a low proof stress metal having a proof stress of not greater than 110 N/mm; and a brazing material layer () provided on the intermediate metal layer () and composed of a silver brazing alloy mainly comprising silver. The intermediate metal layer () and the brazing material layer () are press- and diffusion-bonded to each other, and the brazing material layer () has a blistered area ratio of not greater than 0.5% as observed on an outer surface of the brazing material layer. The low proof stress metal is preferably oxygen-free copper. A lid produced from the lid material () exhibits an excellent bonding property when the lid is brazed to a case mainly composed of a ceramic material for an electronic component package. Further, the lid suppresses the breakage of the case, and ensures excellent brazing workability.