The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2005

Filed:

Sep. 10, 2003
Applicants:

Katsumi Kobinata, Tokyo, JP;

Yoshiki Furukawa, Tokyo, JP;

Takahiko Nozaki, Tokyo, JP;

Inventors:

Katsumi Kobinata, Tokyo, JP;

Yoshiki Furukawa, Tokyo, JP;

Takahiko Nozaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L029/267 ;
U.S. Cl.
CPC ...
Abstract

A substrate () is composed of laminated green sheets. The substrate () is provided with recesses () formed on at least two locations deeper than implemented heights of ICs () and elements (). A transmitter and a receiver are mounted in different recesses, which are individually covered with a mold resin to form a molded optical communication module (), which operates fast and causes no optical and electrical crosstalk.


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