The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2005
Filed:
Aug. 20, 2002
Applicants:
Ichiro Terunuma, Yachiyo, JP;
Kazuya Akashi, Tomisato, JP;
Atsushi Momota, Ohta, JP;
Inventors:
Assignee:
Fujikura Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K001/00 ;
U.S. Cl.
CPC ...
Abstract
A conductive pattern made of copper foil is formed on a base material in each of a plurality of laminated flexible printed circuit boards, and a land is formed to expose the conductive pattern at a predetermined position in the base material. The plurality of flexible printed circuit boards are laminated to adjust each land, and the conductive pattern of each flexible printed circuit board is connected through the each land.
Terunuma, Ichiro. (2005). Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof (U.S. Patent No. 6921869). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6921869
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile