The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2005

Filed:

Jul. 22, 2004
Applicants:

Kenji Nakano, Kurashiki, JP;

Naohiko Uchiumi, Okayama, JP;

Kaoru Ikeda, Kurashiki, JP;

Inventors:

Kenji Nakano, Kurashiki, JP;

Naohiko Uchiumi, Okayama, JP;

Kaoru Ikeda, Kurashiki, JP;

Assignee:

Kuraray Co., Ltd., Kurashiki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L029/04 ;
U.S. Cl.
CPC ...
Abstract

The present invention is directed to a resin composition superior in barrier properties and also superior in flexibility, secondary processability and interlayer adhesiveness. The present invention is also directed to an environmentally friendly method for producing a resin composition, the method releasing no carboxylic acid such as acetic acid to the peripheral environment. The invention provides an EVOH resin composition (F) which has a content of an alkali metal salt (A), in terms of the alkali metal, of 0.1 to 20 μmol/g and a content of a carboxyl acid or its salt (C), in terms of carboxylate radical, of 2 μmol/g or less and which has an ethylene content of 5 to 60 mol % and a saponification degree of from 80 to 99 mol %. In addition, the invention provides a resin composition comprising the EVOH resin composition (F) and an EVOH having an ethylene content of 5 to 60 mol % and a degree of saponification of 99.2 to 100 mol %.


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