The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2005
Filed:
Jan. 21, 2003
Applicant:
Takuya Takahashi, Sakata, JP;
Inventor:
Takuya Takahashi, Sakata, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K031/00 ;
U.S. Cl.
CPC ...
Abstract
A tip of a wire is bonded to a first electrode by using a tool. The wire is drawn from the first electrode to a bump on a second electrode. Apart of the wire is bonded to the center of the bump or a portion of the bump beyond the center in a drawing direction of the wire by using a part of the tool on a first electrode side in the drawing direction of the wire.
Quick Actions:
Takahashi, Takuya. (2005). Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment (U.S. Patent No. 6921016). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6921016
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile