The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2005

Filed:

Jul. 02, 2004
Applicants:

Kentaro Yonehara, Shizuoka, JP;

Motoaki Ito, Shizuoka, JP;

Hiroshi Fujinami, Shizuoka, JP;

Yoshio Imahori, Shizuoka, JP;

Inventors:

Kentaro Yonehara, Shizuoka, JP;

Motoaki Ito, Shizuoka, JP;

Hiroshi Fujinami, Shizuoka, JP;

Yoshio Imahori, Shizuoka, JP;

Assignee:

Star Micronics., Ltd., Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R025/00 ;
U.S. Cl.
CPC ...
Abstract

To provide an electret capacitor microphone in which change of sensitivity characteristic caused by thermal deformation of an electret layer can be prevented even in the case where a reflow process is carried out. An electret capacitor microphone includes: an electret capacitor portion including a diaphragm, and a back electrode plate disposed opposite to the diaphragm through a spacer; an electrically insulating bush for electrically insulating/supporting an outer circumferential edge portion of the back electrode plate; a metal cover in which the electret capacitor portion and the electrically insulating bush are stored; and a gate spring having a pressing function for elastically pressing the back electrode plate toward the diaphragm to form a predetermined gap between the electrically insulating bush and an inner surface of a rear wall of the metal cover. Consequently, collapse of a spacer-abutting portion of an electret layer is prevented from being caused by thermal expansion.


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