The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2005
Filed:
Nov. 07, 2001
Sandra M. Tsontzidis, Mississauga, CA;
Laurence M. C. Lai, Mississauga, CA;
Neilson Zeng, North York, CA;
Sandra M. Tsontzidis, Mississauga, CA;
Laurence M. C. Lai, Mississauga, CA;
Neilson Zeng, North York, CA;
Graphic Packaging International, Inc., Marietta, GA (US);
Abstract
Indentation patterns are scored in microwave packaging materials to enhance the baking and browning effects of the microwave packaging materials on food products. The indentation patterns provide venting to either channel moisture from one area of the food product to another, trap moisture in a certain area to prevent it from escaping, or channel the moisture completely away from the food product. The indentation patterns cause the microwave packaging material underneath a food product to be slightly elevated above the cooking platform in the base of a microwave. The indentation patterns lessen the heat sinking effect of the cooking platform by providing an air gap for insulation. Elevating the base of the microwave packaging material further allows more incident microwave radiation to propagate underneath the microwave packaging material to be absorbed by the food product or by microwave interactive materials in the microwave packaging material that augment the heating process.