The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2005
Filed:
May. 07, 2004
Satofumi Kinei, Soraku-gun, JP;
Satofumi Kinei, Soraku-gun, JP;
Sharp Kabushiki Kaisha, Abeno-ku, JP;
Abstract
On a mount surface portion of a semiconductor laser device, a first bonding layer is so formed that a first region near a light-emitting area is exposed. On a mount surface portion of a sub mount is formed a second bonding layer having a melting point Tlower than a melting point Tof the first bonding layer. The first and second bonding layers are heated in a mutually pressed state at a temperature T lower than the melting point Tof the first bonding layer but higher than the melting point Tof the second bonding layer (T>T>T) to bond the semiconductor laser device to the sub mount. When the semiconductor laser device is bonded to the sub mount, the first region serves as the non-bonding area.