The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2005
Filed:
Aug. 01, 2002
Koichi Kawamura, Shizuoka-ken, JP;
Sumiaki Yamasaki, Shizuoka-ken, JP;
Takao Nakayama, Shizuoka-ken, JP;
Takeyoshi Kano, Shizuoka-ken, JP;
Miki Takahashi, Shizuoka-ken, JP;
Koichi Kawamura, Shizuoka-ken, JP;
Sumiaki Yamasaki, Shizuoka-ken, JP;
Takao Nakayama, Shizuoka-ken, JP;
Takeyoshi Kano, Shizuoka-ken, JP;
Miki Takahashi, Shizuoka-ken, JP;
Fuji Photo Film Co., Ltd., Minami-Ashigara, JP;
Abstract
There are provided a conductive pattern material and a pattern-forming method by which a fine pattern having a high resolution and no wire breakage is obtained. The conductive pattern material is such that on a support surface a pattern-forming layer is formed which allows the formation of a hydrophilic/hydrophobic region directly bonded to the support surface due to energy imparted. Energy is imparted to the pattern-forming material in an imagewise manner to form the conductive material layer.