The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2005
Filed:
Mar. 14, 2003
Applicants:
Yumi Sanaka, Kanagawa, JP;
Isamu Nakao, Tokyo, JP;
Tadashi Ishibashi, Kanagawa, JP;
Katsuya Shirai, Kanagawa, JP;
Inventors:
Yumi Sanaka, Kanagawa, JP;
Isamu Nakao, Tokyo, JP;
Tadashi Ishibashi, Kanagawa, JP;
Katsuya Shirai, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/50 ;
U.S. Cl.
CPC ...
Abstract
Disclosed is a method of mounting chips, including the steps of: dipping a mounting board in a solvent in which chips are dispersed; and mounting the chips on the mounting board by forming electric field gradients on the mounting board in correspondence with positions where the chips are to be mounted. With this configuration, fine chips such as fine semiconductor chips can be mounted at desired positions on a mounting board with a high efficiency and a high yield.