The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2005
Filed:
Dec. 06, 2001
Shinya Seno, Tokyo, JP;
Toshiharu Hatakeyama, Tokyo, JP;
Shinya Seno, Tokyo, JP;
Toshiharu Hatakeyama, Tokyo, JP;
Ricoh Company, Ltd., Tokyo, JP;
Abstract
A resin molding device, resin molding method and resin molded product capable of guiding a sink to an optional position to perform a precise molding. A resin molding metal mold includes a gate formed in the central part of a cavity, a stepped part increasing the opening diameter of the cavity in the circumferential direction orthogonal to the flowing direction of a molten resin introduced into the cavity from the gate, and a fine outside air inlet part circumferentially formed on the outer part from the stepped part. The outside air inlet part is formed of a porous material and allowed to communicate with the outside of the resin molding metal mold through a communicating passage. Accordingly, the molten resin injected into the cavity from the gate is cooled with the outside air introduced from the outside air inlet part formed in the area except a transfer part after the reduction in resin pressure by the stepped part to generate a sink, forming a non-transfer part, so that the transfer property of the transfer part can be improved to enhance the shape precision of the molded product.