The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Jun. 27, 2003
Nozomu Matsukawa, Nara, JP;
Masayoshi Hiramoto, Ikoma, JP;
Akihiro Odagawa, Tsuchiura, JP;
Yasunari Sugita, Osaka, JP;
Mitsuo Satomi, Katano, JP;
Yoshio Kawashima, Neyagawa, JP;
Nozomu Matsukawa, Nara, JP;
Masayoshi Hiramoto, Ikoma, JP;
Akihiro Odagawa, Tsuchiura, JP;
Yasunari Sugita, Osaka, JP;
Mitsuo Satomi, Katano, JP;
Yoshio Kawashima, Neyagawa, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A magnetoresistive element includes a pair of ferromagnetic layers and a non-magnetic layer arranged between the ferromagnetic layers. At least one of the ferromagnetic layers has a composition expressed by (ML)Rat the interface with the non-magnetic layer. The non-magnetic layer includes at least one element selected from the group consisting of B, C, N, O, and P. Here, M is FeCoNi, L is at least one element selected from the group consisting of Pt, Pd, Ir, and Rh, R is an element that has a lower free energy to form a compound with the element of the non-magnetic layer that is at least one selected from the group consisting of B, C, N, O, and P than does any other element included in the composition as M or L, and a, b, c, x, y, and z satisfy a+b+c=100, a≧30, x+y=100, 0<y≦35, and 0.1≦z≦20. This element can provide a high MR ratio. A method for manufacturing a magnetoresistive element includes a first heat treatment process at 200° C. to 330° C. for not less than one hour and a second heat treatment process at not less than 340° C. performed after the first heat treatment process.