The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6916734 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 12, 2005

Filed:

Sep. 30, 2003
Applicant:

Ming-tung Shen, Taipei, TW;

Inventor:

Ming-Tung Shen, Taipei, TW;

Assignee:

Info Point Enterprises Limited, Causeway Bay, HK;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/4763 ;
U.S. Cl.
CPC ...
Abstract

A semiconductor device has a lower metal layer, a lower dielectric layer on top of the lower metal layer, an upper metal layer on top of the lower dielectric layer, an upper dielectric layer on top of the upper metal layer, and a contact region formed as a cavity that extends through the upper dielectric layer, the upper metal layer and the lower dielectric layer for access to a solder pad portion of the lower metal layer. A dielectric lining layer lines a peripheral cavity-confining surface of the cavity, and is transverse to a plane of the lower metal layer. The dielectric lining layer isolates the upper metal layer from the lower metal layer while permitting access to the solder pad portion of the lower metal layer. An electrical contact fills the cavity, and enables external electrical connection with the lower metal layer.


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