The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Feb. 27, 2001
Tsutomi Mitani, Akashi, JP;
Hiroaki Takezawa, Nara, JP;
Yukihiro Ishimaru, Hirakata, JP;
Takashi Kitae, Higashiosaka, JP;
Yasuhiro Suzuki, Atani, JP;
Tsutomi Mitani, Akashi, JP;
Hiroaki Takezawa, Nara, JP;
Yukihiro Ishimaru, Hirakata, JP;
Takashi Kitae, Higashiosaka, JP;
Yasuhiro Suzuki, Atani, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesiveon a substrate electrodeof a circuit substrateand also for packaging an electronic element. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.