The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Jun. 02, 2003
Koji Nakamura, Saitama, JP;
Koji Nakamura, Saitama, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A method for manufacturing a semiconductor using a wafer carrier, wherein the temperature of a wafer can be made uniform with few differences in surface composition distribution. A plurality of grooves are formed at the bottom of a wafer pocket of a wafer carrier, to make uniform the temperature of the wafer surface by diffusing heat. The grooves are deeper at the peripheral part of the wafer than at the central part, and groove density is higher at the peripheral part than at the central part. The groove patterns may include a plurality of wedge-shaped grooves widening from the central part toward the peripheral part, a plurality of circular grooves with narrowing interval therebetween from the central part toward the peripheral part, circular grooves with the diameter shortened from the central part toward the peripheral part, and square grooves with shortened sides from the central part toward the peripheral part.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile