The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Oct. 05, 2000
Applicants:
Minoru Takaya, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Inventors:
Minoru Takaya, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Assignee:
TDK Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K001/20 ;
U.S. Cl.
CPC ...
Abstract
The present invention relates to a soldering flux, a soldering paste and a soldering method that achieve a sufficient degree of bonding strength even when components are mounted at a higher density, components are further miniaturized or components are mounted with a smaller pitch. A fluxcontains an adhesive resin and a hardening agent. This flux or a soldering paste containing the flux is applied onto a component mounting board, and then, an electronic componentis mounted and soldered onto the component mounting board