The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
May. 29, 2002
Applicants:
Shinji Watanabe, Tokyo, JP;
Hiroshi Sakai, Tokyo, JP;
Motoji Suzuki, Tokyo, JP;
Makoto Igarashi, Niigata, JP;
Akihiro Tanaka, Niigata, JP;
Inventors:
Shinji Watanabe, Tokyo, JP;
Hiroshi Sakai, Tokyo, JP;
Motoji Suzuki, Tokyo, JP;
Makoto Igarashi, Niigata, JP;
Akihiro Tanaka, Niigata, JP;
Assignee:
NEC Corporation, , JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K031/02 ;
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted on the printed circuit board by reflow processing.