The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Feb. 28, 2000
Donald C. Abbott, Norton, MA (US);
John E. Cotugno, Little Compton, RI (US);
Robert M. Fritzsche, Attleboro, MA (US);
Robert A. Sabo, Smithfield, RI (US);
Christopher M. Sullivan, Rochester, MA (US);
David W. West, Pembroke, MA (US);
Donald C. Abbott, Norton, MA (US);
John E. Cotugno, Little Compton, RI (US);
Robert M. Fritzsche, Attleboro, MA (US);
Robert A. Sabo, Smithfield, RI (US);
Christopher M. Sullivan, Rochester, MA (US);
David W. West, Pembroke, MA (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method for the fabrication of a double-sided electrical interconnection flexible circuit () particularly useful as a substrate for an area array integrated circuit package. A copper matrix with studs () is pressed through a dielectric film () having a copper layer on the opposite surface, thereby forming an intermediate structure for a flex circuit with self-aligned solid copper vias in a one step process. The contacts are reinforced by plating both surfaces with a layer of copper, and conventional processes are used to complete the circuit patterning.