The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2005

Filed:

May. 18, 2004
Applicants:

Eriko Ajioka, Tokyo, JP;

Shigeru Asami, Tokyo, JP;

Hideaki Shimoda, Tokyo, JP;

Hiroshi Ikeda, Tokyo, JP;

Yoshinari Yamashita, Tokyo, JP;

Hitoyoshi Kurata, Tokyo, JP;

Inventors:

Eriko Ajioka, Tokyo, JP;

Shigeru Asami, Tokyo, JP;

Hideaki Shimoda, Tokyo, JP;

Hiroshi Ikeda, Tokyo, JP;

Yoshinari Yamashita, Tokyo, JP;

Hitoyoshi Kurata, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K009/00 ;
U.S. Cl.
CPC ...
Abstract

An electronic component module includes a mounting substrate including a shield layer and on which a first cavity and a second cavity are formed. A first electronic component positioned in the first cavity is used in a first frequency band. A second electronic component positioned in the second cavity is used in a second frequency band. Lid members seal the first cavity and the second cavity. Patch antennas transmit/receive radio waves in the first and second frequency bands, the antennas being formed on a surface opposite to the electronic components mounting surface. And, connection terminals formed on the mounting substrate are electrically connected to the electronic components through transmission lines.


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