The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
May. 21, 2003
Nozomi Shimoishizaka, Kyoto, JP;
Kazuyuki Kaino, Osaka, JP;
Yoshifumi Nakamura, Osaka, JP;
Keiji Miki, Kyoto, JP;
Kazumi Watase, Kyoto, JP;
Ryuichi Sahara, Osaka, JP;
Nozomi Shimoishizaka, Kyoto, JP;
Kazuyuki Kaino, Osaka, JP;
Yoshifumi Nakamura, Osaka, JP;
Keiji Miki, Kyoto, JP;
Kazumi Watase, Kyoto, JP;
Ryuichi Sahara, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a plurality of pad electrodes formed on the main surface of the chip and electrically connected to the integrated circuit. The first insulating film of an insulating resin material is formed on the main surface of the semiconductor chip, covers the integrated circuit, and includes a plurality of contact holes provided on the respective pad electrodes. The inductor is formed on the inductor formation region of the first insulating film, and both terminals of the inductor are connected to the pad electrodes through the contact holes, respectively. The inductor formation region of the first insulating film is formed thicker than a portion of the first insulating film around the contact hole.