The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Jul. 18, 2003
Takatoshi Kobayashi, Nagano, JP;
Tadashi Miyasaka, Nagano, JP;
Katsumi Yamada, Nagano, JP;
Akira Morozumi, Nagano, JP;
Takatoshi Kobayashi, Nagano, JP;
Tadashi Miyasaka, Nagano, JP;
Katsumi Yamada, Nagano, JP;
Akira Morozumi, Nagano, JP;
Fuji Electric Co. Ltd., Kawasaki, JP;
Abstract
A power semiconductor module has a circuit assembly body, which includes a metal base, a ceramic substrate, and a power semiconductor chip, and is combined with a package having terminals formed integrally. The ceramic substrate of the module has a structure such that an upper circuit plate and a lower plate are joined to both sides of a ceramic plate, respectively, and the metal base and the ceramic substrate are fixed to one another using solder, thereby improving reliability and lengthening a life of a power semiconductor module by optimizing a ceramic substrate and a metal base thereof, the dimensions thereof, and material and method used for a join formed between the ceramic substrate and metal base.