The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2005

Filed:

Dec. 18, 2003
Applicant:

Tsunehiko Nakamura, Kokubu, JP;

Inventor:

Tsunehiko Nakamura, Kokubu, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B003/68 ;
U.S. Cl.
CPC ...
Abstract

To provide a wafer heating apparatus that can measure a surface temperature of a wafer accurately and responsively. A front surface of a ceramic plateserves as a mounting surface on which a wafer is placed, and a rear surface or an inner portion of the ceramic plateis formed with a resistance heating elementA recessis formed in the rear surface of the ceramic plateA temperature measuring member formed of a temperature sensorand leadsis inserted in the recessso as to be held by fillingIn the wafer heating apparatus, a length along the leads from the front of the protective tube to a point where the leads are exposed from the filling is set to 5 to 30 times an outer diameter of the protective tube.


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