The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Sep. 24, 2003
Shinji Inazawa, Osaka, JP;
Hiroshi Takada, Osaka, JP;
Akihisa Hosoe, Osaka, JP;
Kouji Nitta, Osaka, JP;
Shinji Inazawa, Osaka, JP;
Hiroshi Takada, Osaka, JP;
Akihisa Hosoe, Osaka, JP;
Kouji Nitta, Osaka, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A board for printed wiring comprises an electromagnetic wave absorbing laminate (EM) provided on a surface of a substrate () with the intervention of an adhesive layer () of a metal oxide, the electromagnetic wave absorbing laminate (EM) comprising: (a) a magnetic layer () comprising a plurality of magnetic particles () having an average particle diameter of 1 to 150 nm and isolated from each other by an electrically insulative material (); and (b) an electrically insulative layer (), being alternately stacked in a multi-layer structure, the board for printed wiring has a reduced thickness and an improved electromagnetic wave absorbing characteristic in a high frequency band of not lower than gigahertz, as compared with a conventional one which has an electromagnetic wave absorbing layer of a composite material including fine magnetic particles simply dispersed in a resin binder.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile